Sapphire, zirconia ceramics, silicon carbide plus

　　LED chip back thinning grinding wheel is used for precision grinding of superhard semiconductor materials such as sapphire,SiC,etc.,such as LED sapphire substrate back thinning,SiC substrate,GaAs substrate,etc.

　　Using metal materials with metal bonds and covalent bonds as the grinding wheel binder,the diamond grinding wheel prepared has excellent performance,and has:

　　1.Self sharpening(maintain the sharpness of the grinding wheel and high cutting ability)

　　2.High type retention(long service life)

　　3.Easy to repair type(low speed repair type)

　　4.High chip capacity chip removal

　　5.Low scratch rate,low fragment rate